Changsha anmuquan Intelligent Technology Co., Ltd., founded by Dr. Zhu Wenhui, a national expert, focuses on the development of advanced integrated circuit packaging and product, packaging process software, relying on the international advanced system level packaging technology (SIP) to solve key core devices such as CPU (central processing unit), DSP (digital signal processor), GPU (image processor), SSD (solid-state memory) The independent manufacturing of IGBT (insulated gate bipolar diode) is the only semiconductor packaging and testing company with the world's advanced level in Hunan Province, which fills the blank of high-end chip packaging in Hunan Province and Changsha City. The company will strive to become the leading high-end chip advanced packaging and testing company in China.

        The company is located in Lugu innovation and entrepreneurship Park. The first phase covers an area of 5000 square meters, including 1600 square meters of purification workshop area and 3400 square meters of office area. It is close to several design parks, such as CLP Software Park / military civilian integration Industrial Park / core city science and Technology Park, with convenient transportation, near the ring expressway and Changsha west station.

        The company will actively respond to government policies and contribute to the society

        1. To fill the vacancy of IC packaging industry chain in Hunan Province, to solve the manufacturing problems of core devices in the fields of information security, intelligent manufacturing, mobile Internet, rail transit, etc., is a solid support for independent manufacturing of strategic industries.

        2. Meet the customized packaging requirements of high-end chips, and build the characteristic advantages and leading position of high-end microprocessor chips and control chips.

        3. Introduce high-level talents and teams, attract international and national resources investment, and promote the transformation of scientific and technological achievements and the integration of technology and resources in the upstream and downstream of the industrial chain.

        4. Solve the technical problems of high-end chip packaging, scale and extend to the product end, and create significant economic benefits for the society.